IPCEIAIPCJEDECJ-STD-002E-2017元器件引子、焊、接柱和导可焊

EIA∕IPC∕JEDECJ-STD-002ENovember2017EIA∕IPC∕JEDECJ-STD-002ENovember2017SupersedesJ-STD-002DJune2013JOINTINDUSTRYSTANDARDSolderabilityTestsforComponentLeads,Terminations,Lugs,TerminalsandWiresNoticeEC1A.IPCandJEDECStandardsandPublicationsaredesignedtoservethepublicinterestthrougheliminatingmisunderstandingsbetweenmanufacturersandpurchasers,facilitatinginterchangeabilityandimprovementofproducts,andassistingthepurchaserinselectingandobtainingwithminimumdelaytheproperproductforhisparticularneed.ExistenceofsuchStandardsandPublicationsshallnotinanyrespectprecludeanymemberornonmenιberofECIA.IPCorJEDECfrommanufacturingorsellingproductsnotconformingtosuchStandardsandPublications,norshalltheexistenceofsuchStandardsandPublicationsprecludetheirvoluntaryusebythoseotherthanECIA.IPCorJEDECmembers,whetherthestandardistobeusedeitherdomesticallyorinternationally.NoticeRecommendedStandardsandPublicationsareadoptedbyEC1A.IPCorJEDECwithoutregardtowhethertheiradoptionmayinvolvepatentsonarticles,materials,orprocesses.Bysuchaction,ECIA.IPCorJEDECdonotassumeanyliabilitytoanypatentowner,nordotheyassumeanyobligationwhatevertopartiesadoptingtheRecommendedStandardorPublication.UsersarealsowhollyresponsibleforM>tecUngthemselvesagainstallclaimsofliabilitiesforpatentinfringement.Themateria!inthisjointstandardwasdevelopedbytheIPCComponentsandWireSolderabilitySpecificationTaskGroup(5-23b)oftheAssemblyandJoiningProcessesCommittee(5-20).theElectronicComponentsIndustryAssociationSolderingTechnologyCommittee(STC)andtheJEDECSolidStateTechnologyAssociationCommittee(JC14.1)ForTechnicalInformationContact:EIAStandardsForTechnicalInformationContact:EIAStandardsElectronicComponentsIndustryAssociation111!AidermanDrive.Suite400Alpharetta.GA3(XX)5Phone:(678)393-999()Fax:(678)393-9998IPCAssociationConnectingElectronicsIndustries®3000LakesideDrive.Suite105NBannockburn.IL60015-1249Phone:(847)615-71∞Fax:(847)615-7105JEDECSolidStateTechnologyAssociation3103North10thStreet.Suite240∙SArlington.VA22201-2107Phone:(703)907-754()Fax:(703)9()7-7583PleaseusetheStandardImprovementFormshownattheendofthisd~ ©Copyright2017.ECIA.Alpharetta.Georgia.IPC.Bannockbum.Illirxxs.andJEDEC.Arlington.Virginia.USA.Allrightsreservedunderboth$尸internationalandPan-Americancopyrightconventions.Anycopying,scanningorotherreproductionolthesematerialswithoutthepriorwrittenconsentofthecopyrightholder⅛strictlyprohibitedandconstitutesinfringementunderfΛeCopyrightLawol伪。UnitedStates.

aeαronκSmpoxs15内叭λssoc∙atonQpqEIA∕IPC∕JEDECJ-STD-002EaeαronκSmpoxs15内叭λssoc∙atonQpqSolderabilityTestsforComponentLeads,Terminations,Lugs,TerminalsandWiresAjointstandarddevelopedbyIPCComponentandWireSolderabilitySpecificationTaskGroup(5-23b)oftheAssemblyandJoiningProcessesCommittee(5-20),theElectronicComponentsIndustryAssociationSolderingTechnologyCommittee(STC)andtheJEDECSolidStateTechnologyAssociationCommittee(JC14.1)Usersofthispublicationareencouragedtoparticipateinthedevelopmentoffuturerevisions.Supersedes:J-STD-∞2D-June2013J-STD-002Cw/Amendment1-November2008J-STD-002C-December2007Amendment1-October2008J-STD-∞2B-February2003J-STD-∞2A-October1998J-STD-∞2-April1992Contact:EIAStandardsElectronicComponentsIndustryAssociation1111AidermanDrive.Suite400Alpharetta.GA30005Phone:(678)393-9990Fax:(678)393-9998JEDECSolidStateTechnologyAssociation3103North10thStreet.Suite240-SArlington.VA22201-2107Phone:(703)907-7540Fax:(703)907-7583IPCAssociationConnectingElectronicsIndustries®3000LakesideDrive.SuiteI05NBannockburn.IL60015-1249Phone:(847)615-71∞Fax:(847)615-7105∣Mus∣⅛mTħisPageIntentionallyLeftBlankNovember2017 November2017 ELMPC/JEDECJ∙STD∙002ENovember2017 November2017 ELMPC/JEDECJ∙STD∙002EAcknowledgmentAnydocumentinvolvingacomplextechnologydrawsmaterialfromavastnumberofsourcesacrossmanycontinents.WhiletheprincipalmembersoftheIPCComponentandWireSolderabilitySpecificationTaskGroup(5-23b)oftheAssemblyandJoiningProcessesCommittee(5-20)areshownbelow,itisnotpossibletoincludeallofthoseweassistedintheevolutionofthisjointindustrystandard.Additionally,thereweremanyparticipantsfromtheEIΛ(ElectronicComponentsIndustryAssociation)SolderingTechnologyCommittee(STC)andtheJEDECSolidStateTechnologyAssociationCommittee(JC-14.1)ReliabilitylestMethodsforPackagedDevices.Note:IPCistheleadorganizationandresponsiblefortypesettingandreleaseofthisstandard.Toeachofthem,themembersandstaffsofIPC.ECIAandJEDECAssociationsextendtheirgratitude.IPCAssembly&JoiningProcessesCommitteeIPCComponent&WireSolderabilitySpecificationTaskGroupEC1ASolderingTechnologyCommitteeCo-ChairsChairChairDanFosterDavidD.HillmanDouglasW.RommMissileDefenseAgencyRockwellCollinsTexasInstrumentsInc.LeoPLambertViceChairEPTACCorporationDennisFritzViceChairDr.KarenTe!lefsenAlphaAssemblySoluHonsJEDECJC14.1ReliabilityTestMethodsforPackagedDevicesChairIfeHsuIntelCorporationMacDermidEnthoneElectronicsSolutionsIIPCComponent&WireSolderabilitySpecificationTaskGroupDonaldAbbott.SensataTechnologiesDavidAdams.RockwellCollinsDominikAlder.LockheedMartinSpaceSystemsCompanyGregAlexander.Ascentech.LLCElizabethAllison.NTS-BaltimoreGustavoArredondo,ParaTechCoatingInc.ChrisBall.ValeoInc.MarvinBanksDr.MartinBayes,TECtmnectivityBillBeair.RaytheonCompanyMaryBellonFrederickBeltran.L-3CommunicationsJamesBielick.IBMCorporationGeraldLeslieBogert.BechtelPlantMachinery.Inc.TrevorBowers,AdtranInc.LanceBrack.RaytheonMissileSystemsEdwinBradley.MotorolaSolutions.Inc.JasonBragg.Ce!estica-SuzhouDr.PeterBratin.ECITechnology.Inc.VanjaBukva.TeledyneDalsaMartinBunce.MacDermidEnthoneElectronicsSolutionsFritzBy!e.AstronauticsCorp,ofAmericaThomasCaristrom.EricssonABThomasCarroll.BoeingCompanyGiovanniCasanova.SchweitzerEngineeringLaboratories.Inc.CaletteChamness.U.S.∕∖rmyAviation&MissileCommandLaya(Yan)Chen.MicrotekChangzhouLaboratoriesDr.BeverleyChristian.HDPUserGroupMichaelConnors.NTS-ChicagoPaulCooke.FTGCircuitsDavidCorbett.DLΛLandandMaritimeAlejandroCπιz.Jabi!MexicoJamesDaggett.RaytheonCompanyRichardDavidson.HoneywellAerospaceRossDillman.ΛCITechnologies.Inc.GlennDody.DodyConsultingMiguelDominguez.ContinentalIemicSAdeCVRichardEdgar.Tec-LineInc.TheodoreEdwardsErnstEggelaar,MicrotronicArturoEspejo.KesterBrianFlemming.NationalInstrumentsw*黑上望篇黑;投档DarrellFrciwaIJ.NorthropGrummanSystemsCoronationlT8.COmMark幽全AutomotiveSystemsIIIEIAΛPC∕JEDECJ-STD-002E EIAΛPC∕JEDECJ-STD-002E NCΛιembθr2017EIAΛPC∕JEDECJ-STD-002E EIAΛPC∕JEDECJ-STD-002E NCΛιembθr2017GeraldGagnon.ExtechInstrumentsCorporationMahendraGandhi.NorthropGrummanAerospaceSystemsDonaldGerstle.GoogleInc.Dr.RezaGhaffarian.JetPropulsionLaboratoryAndrewGiamis.AndrewCorporationCjrnthiaGomez,ContinentalTemicSAdeCVConstantinoGonzalez.ACMETraining&ConsultingBenGumpert.LockheedMartinMissile&FireControlVickaHammill,HoneywellInc.AirTransportSystemsDr.CarolHandwerker.PurdueUniversityShirleyHe.The5thElectronicInstituteofMilRobertHeber,DLALandandMaritimeStevenHerrberg.RaytheonSystemsCompanyGastonHidalgo.SamsungElectronicsAmericaEddieHofer,RockwellCollinsIfeHsu.IntelCorporationDr.ChristopherHuntPiretaRichardIodice.RaytheonCompanyToddJarman.L-3CommunicationsMichaelJawitz.OrbitalATKSharissaJohns.LockheedMartin^Missiles&FireControlPι)ιkashKapadia.Celestica-SuzhouG⅛ggKlawson.GeneralDynamics:.MissionSystemsDf：ChristianKlein.RobertBosch⅛mbHJasonKoch.RobisanLaboratoryInc.Dr.WeiKoh.PacrimTechnologyRichardKraszewski.PlexusCorp.JefferyKukelhan.BΛESystemsPlatformSolutionsVijayKumar.LockheedMartinMissile&FireControlMarkKwoka.IntersilCorporationHarjinderLadhar.∏extronicsLeoLambert.EPTACCorporationDavidLober.KyzenCorporationKyleLoomis,KesterToddMacFadden.BoseCorporationDr.BrianMadsen.Continental√∖utomotiveSystemsJamesMaguire.IntelCoηporationChrisMahanna.RobisanLaboratoryInc.ReneeMichalkiewicz.NTS-BaltimoreGeorgeMilad.UyemuraInternationalCoψ.Dr.Kil-WonMoon.NISTMichaelMoore.U.S.ArmyAviation&MissileCommandMichaelMora.DeltaGroupElectronicsInc.RobertMorris,RaytheonMissileSystemsTerryMunson.Foresite.Inc.JoshuaMuonio.AnalogTechnologiesCorporationHayesMyers.FTGCircuitsSuzanneNachbor.HoneywellAerospaceMinneapolisGrahamNaisbitt,Gen3SystemsLimitedMarkNorthrup.IECElectronicsAnalysisandTestingLaboratoriesGerardO,Brien.SolderabilityTesting&Solutions.Inc.DeboraObitzJ.LeeParker.JLPMelParrishDouglasPauls,RockwellCollinsMichaelPavlov,ECITechnology.Inc.JohnRadman.NTSGuyRamsey.R&DAItanovaHenryRekers.SchneiderElectricIvanRoman.ContinentalTemicSAdeCVIreneRomero.DeltaGroupElectronicsInc.DouglasRomm.TexasInstrumentsInc.MarkRoutley,Gen3SystemsLimitedWilliamRussell.RaytheonProfessionalServicesLLCMartinScionti.RajlheonMissileSystemsJeffSeekatz.RaytheonCompanyWilliamSepp.TechnicInc.JoseServinOlivares.ContinentalTemicSΛdeCVRussel!Shepherd.NTSJosephSherfick.NSWCCraneLowellSherman.DLΛLandandMaritimeJeffShubr∞ks.RaytheonCompanyPrabjitSingh.IBMCorporationBradleySmith.AllegroMicroSystemsInc.ManuelSolis.Foresite.Inc.RogerSu.L-3CommunicationsFujiangSun.HuaweiTechnologiesCo.,Ltd.KeithSweatman.NihonSuperiorCo.,Ltd.ToshiyasuTakei.NSKCo..Itd.RoyceTaylor.RaytheonCompanyBobTeegarden.HoneywellInternationalDr.Karenlellefsen.AlphaAssemblySolutionsJohnThompson.FCIUSA.Inc.MichaelToben.DowElectronicMaterialsDr.Brianlbleno.MicrosoftCorporationYunhua(Danny)Tu.HuaweiTechnologiesCo.,Ltd.DonaldTyler.CorfinIndustriesLLCBillVuono.QorvoGregWade.IndiumCoqx>rationBrianWardhaugh.Gen3SystemsLimitedDr.UdoWelzel.RobertBoschGmbHGeorgeWenger.AndrewCoηporationRobertWettermann.BESTInc.MartinWickham.NationalPhysicalLaboratoryMaureenWilliams.NISTRussellWinslow.SixSigmaNeilWitkowski.WitkowskiConsultingJereWittigLindaWoody,LWCConsultingYung-HerngYau,MacDermidEnthoneElectronicsSolutionsMichaelYuen.HongfujinPrecisionIndustryShenzhenCo.,Ltd.∣November2017 November2017 EIA∕IPC∕JEDECJ-STD-∞2EEIA∕IPC∕JEDECJ-STD-∞2E EIA∕IPC∕JEDECJ-STD-∞2E November2017TableofContentsTOC\o"1-5"\h\zPREFACE 1Scope 1Purpose 1ShallandShould 1DocumentHierarchy 1MethodClassification 1VisualAcceptanceCriteriaTests 1ForceMeasurementTests 1CoatingDurability 2SolderabilityBackwardsCompatibility 2RefereeVerificationSolderDipforTestsA,B,C,Al,Bl,andC! 2Limitations 2ContractualAgreement 2TermsandDefinitions 2APPLICABLEDOCUMENTS 3Industry 3.!.1 IPC 3.1.2 InternationalElectrotechnicalCommission…,.32.2 Government 3Federa!5 33 REQUIREMENTS 33.1 Materials 3Solder 3j 3.!.2 Flux 4[ FluxMaintenance 4+ 3.l.3 StandardCopperWrappingWires 4；3.1.4 Water 43.2 Equipment 4> 3.2.1 SteamPreconditioningApparatus 4BakePreconditioningApparatus 5OpticalInspectionEquipment 5RefereeMagnification 5DippingEquipment 5TimingEquipment 5PreparationforTesting 5SpecimenPreparationandSurfaceCondition 5PreconditioningCategories 6SteamCondit沁ning 6PostSteamConditioningDrying 6332.2 SteamEquipmentMaintenance 6SurfacestobeTested 6SolderBathRequirements 6SolderContaminationControl 64TESTPROCEDURES 7ApplicationofFlux 7VisualAcceptanceCriteria Tests 7TestA-SnPbSolder-SolderBath/DipandL∞kTest(Leads,Wires,etc.) 7!.1 √∖pparatus 7SolderPot/Bath 7DippingDevice 7Preparation 8TestParameters 8Procedure 9Evaluation 9Magnification 9Λccept∕RejectCriteria 9TestB-SnPbSolder-SolderBath/DipandL∞kTest(LeadlessComponents) 9Apparatus 9SolderPot/Bath 9DippingDevice 9Preparation 9TestParameters 9Procedure 10Evaluation 10Magnification 10Λccept∕RejectCriteria 10TestC-SnPbSolder-WrappedWiresTest(Lugs,Tabs,Terminals,LargeStrandedWires) 10Apparatus 10SolderPot/Bath 102 DippingDevice 11Preparation 11TestParameters 11Procedure 12Evaluation 12Magnification 12Accept/RejectCriteria 12TestD-SnPborPb-freeSolder-ResistancetoDissolutionofMetallizationTest 12√∖pparatus 12SolderPot/Bath 12

DippingDevice 12Attitude(AngleofImnιers沁n) 12Preparation 12TestParameters 12Procedure 12Evaluation 13Magnification 13Λccept∕RejectCriteria 134.2.5 TestS-SnPbSolder- SurfaceMountProcessSimulationTest 13Apparatus 13Stencil/Screen 13PasteApplicationTool 13PasteDispensing 13TestSubstrate 13SnPbReflowEquipment 13Preparation 14TestParameters 14Procedure 14Evaluation 14Magnification 14Accept/RejectCriteria 4.2.6TestA1-Pb-freeSolder-SolderBath/DipandLookTest(Leads,Wires,etc.) 4.2.6.!Apparatus SolderPot/Bath TOC\o"1-5"\h\zDippingDevice 15Preparation 15TestParameters 15Procedure 15Evaluation 15Magnification 15Accept/RejectCriteria 15TestBI-Pb-free Solder-SolderBath/DipandLookTest(LeadlessComponents) 15Apparatus 15SolderPot/Bath 15VerticalDippingDevice 15Preparation 16TestParameters 16Procedure 16Evaluation 16Magnification 16Accept/RejectCriteria 16TestCl-Pb-freeSolder-WrappedWiresTest(Lugs,Tabs,Terminals,LargeStrandedWires) 16Apparatus 16SolderPot/Bath 16DippingDevice 16Preparation 17TestParameters 17Procedure 17Evaluation 17Magnification 17Accept/RejectCriteria 17TestSI-Pb-freeSolder -SurfaceMountProcessSimulation Test 17Apparatus 18Stencil/Screen 18PasteApplicationTool 18PasteDispensing 18TestSubstrate 18Pb-freeReflowEquipment 18Preparation 18TestParameters 18Procedure 18Evaluation — .I..I..14.3.12Accept/RejectCriteria ForceMeasurementTests TestE-SnPbSolder-WettingBalanceSolderPotTest(LeadedComponents)...Apparatus 191919DippingDevice…191919Preparation Materials SolderTemperatureProcedure 原创力文档,.max,b.QQk.lJB8S⅞8bm-致下ςjw½*w 20TOC\o"1-5"\h\z原创力文档,.max,b.QQk.lJB8S⅞8bm-致下ςjw½*w 204.3.l.6.l Magnification 20!.6.2 Accept/RejectCriteria 204.3.2 TestF-SnPbSolder-WettingBalanceSolderPotTest(LeadlessComponents) 20Apparatus 20DippingDevice 20Preparation 204.323 Materials 2i4 SolderTemperature 215 Procedure 21Evaluation 221 Magnification 22Accept/RejectCriteria 224.3.3 TestG-SnPbSolder-WettingBalanceGlobuleTest 22Apparatus 22DippingDevice 22Materials 22Flux 22Solder 22TestSpecimen 224.333 Procedure 22TemperatureoftheSolder 22Fluxing 22Dipping∕∖ngle,ImmersionDepth,andImmersionRates 22Preheat 24Evaluation 24Magnification 24SuggestedCriteria 244.3.4 TestEl-Pb-freeSolder-WettingBalanceSolderPotTest(LeadedComponents) 25Apparatus 251.1 DippingDevice 25Preparation 253 Materials 25SolderTemperature 255 Procedure 256 Evaluation 251 Magnification 25Accept/RejectCriteria 254.3.5 TestFl-Pb-freeSolder-WettingBalanceSolderPotTest(LeadlessComponents) 25Apparatus 25DippingDevice 25Preparation 26Materials 264 SolderTemperature 265 Procedure 26Evaluation 26Magnification 26Accept/RejectCriteria 264.3.6 TestGl-Pb-freeSolder-WettingBalanceGlobuleTest 26Apparatus 26.1.1 DippingDevice 26Materials 26Flux 26Solder 26TestSpecimen 2 Procedure 27TemperatureoftheSolder 27Fluxing 27DippingAngle,ImmersionDepth,andImmersionRates 27Preheat 2 Evaluation 2.! Magnification 2.2 SuggestedCriteria 275NOTES 27UseofActivatedFlux 27\o"CurrentDocument"\hMassiveComponents 27SamplingPlans 27CorrectionforBuoyancy 28PreconditioningLimitations 28\o"CurrentDocument"\hCriticalComponentSurfaces 29\o"CurrentDocument"\hEvaluationAids 38CalculationofMaximum\o"CurrentDocument"\hTheoreticalForce 43CalculationofIntegratedValue\o"CurrentDocument"\hofAreaoftheWettingCurve 45InformativeAnnex 46APPENDIXF J-STD4)02∕J-STD-003Activated\o"CurrentDocument"\hSolderabilityTestFluxRationaleCommitteeLetter 47APPENDIXG GraphicalRepresentations:ProgressionofSolderWettingCurveParametersAsMeasuredByWettingBalanceTesting 49APPENDIXHTestProtocolforWettingBalanceGaugeRepeatabilityandReproducibility(GR&R)UsingCopperFoilCoupons 52FiguresTOC\o"1-5"\h\zFigure3-1 ExampleReticle 5Figure4-1 DippingSchematic 8Figure4-2 SolderDippingAngleforSurfaceMount\o"CurrentDocument"\hLeadedComponents 8Figure4-3 SolderDippingDepthforThrough-HoleComponents 9Figure4-4 LeadlessComponentImmersionDepth 10Figure4-5 IllustrationofAcceptableSolderableTerminal 11Figure4-6 IllustrationofUnsolderableTerminal 11Figure4-7 IllustrationofAcceptableSolderabieTOC\o"1-5"\h\zStrandedWire 11Figure4-8 IllustrationofPartiallySolderable StrandedWireShowingIncompleteFillet 11Figure4-9 WettingBalanceApparatus 19Figure4-10 SetAWettingCurve 21Figure4-11 SetBWettingCurve 21Figure4-12ComponentandDippingAngle(DirectlyfromIEC60068-2-69) 24FigureA-1 "J"LeadedComp∞ents 29FigureA-2 PassiveComponents 30FigureA-3 GullWingComponents 31FigureA-4 LeadlessChipCarrier 32FigureA-5 "L"LeadedComponent 33FigureA-6 ExposedPadPackage 34FigureA-7 Bottom-OnlyTerminationComponent 34\o"CurrentDocument"\hFigureA-8 AreaArrayComponentCriticalSurface 35FigureA-9 Through-HoleComponents-FlatPin 36FigureA-10 Through-HoleComponents-RoundPin 37FigureB-1 DefectSizeAid 38FigureB-2 TypesofSolderabilityDefects 39FigureB-3 AidsinEvaluationof5%AllowableAreaofPinHoles 40FigureB-4 AidinEvaluati∞of5%AllowableAreaofPinHoles 41FigureB-5 SolderabilityCoverageGuide 42FigureO1 LeadPeripheryandVolumefora132I/OPQFP 43TablesTaWβ3-1 FluxCompositions 4Table3-2 SteamTemperatureRequirements 5Tabie3-3 PreconditioningParametersforSoWerabilityTesting 6Tabie3-4 MaximumLimitsofSolderBathContaminant7Tabtβ4-1 TestASolderabilityTesting Parameters 87abte4-2 TestBSolderabilityTesting Parameters 10Tabtβ4-3 TestCSolderabilityTasting Parameters 11Tabtβ4-4 TestDSolderabilityTesting Parameters 13TaWβ4-5 StencilThicknessRequirements 13Tabtβ4-6 ReflowParameterRequirements 14Tabtβ4-7 TestSSolderabilityTastingParameters 14TaWβ4-8 TestA1 SolderabilityTestingParameters 15Tabtβ4-9 TestBl SolderabilrtyTestingParameters 16Tabtβ4-10 TestC1 SolderabilityTestingParameters 17Tabtβ4-11 StencilThicknessRequirements 18Tabie4-12 Pb-freeReflowParameterRequirements 18Table4-13 TestS1SolderabilityTestingParameters 18Table4-14WettingBalanceParametersandSuggestedEvaluationCriteria 20Table4-15DippingAngleandImmersionDepthforComponents(DirectlyfromIEC60068-2-69) 23Table4-16 WettingParametersand SuggestedEvaluationCriteria 24TableF-1 FluxCompositions (Same asTable 3-1) 47SolderabilityTestsforComponentLeads,

Terminations,LugsfTerminalsandWiresPREFACEScopeThisstandardprescribestestmethods,defectdefinitions,acceptancecriteria,andillustrationsforassessingthesolderabilityofelectroniccomponentleads,terminations,solidwires,strandedwires,lugs,andtabs.Thisstandardalsoincludesatestmethodfortheresistancetodissolution/dewettingofmetallization.Thisstandardisintendedforusebybothsupplieranduser.PurposeSolderabilityevaluationsaremadetoverifythatthesolderabilityofcomponentleadsandterminationsmeetstherequirementsestablishedinthisstandardandtodeterminethatstoragehashadnoadverseeffectontheabilitytosoldercomponentstoaninter∞nnectingsubstrate.Determinationofsolderabilitycanbemadeatthetimeofmanufacture,atreceiptofthecomponentsbytheuser,orjustbeforeassemblyandsoldering.Theresistancetodissolutionofmetallizationdeterminationismadetoverifythatmetallizedterminationswillremainintactthroughouttheassemblysolderingprocesses.Inthecaseofadiscrepancy,thedescriptionorwrittencriteriaalwaystakesprecedenceovertheillustrations.ShallandShouldThewords**shalΓ,or“shallnot"areusedinthetextofthisdocumentwhereverthereisarequirementformaterials,preparation,processcontrol,oracceptanceofasolderedconnectionoratestmethod.Theword"should"reflectsrecommendationsandisusedtoreflectgeneralindustrypracticesandproceduresforguidanceonly.DocumentHierarchyIntheeventofconflict,thefollowingdecreasingorderofprecedenceapplies:Procurementasagreedbetweenuserandsupplier.Masterdrawingormasterassemblydrawingreflectingtheuser'sdetailedrequirements.Wheninvokedbytheuserorpercontractualagreement,thisdocument.J-STD-002.Otherdocumentstotheextentspecifiedbytheuser/customer.MethodClassificationThisstandarddescribesmethodsbywhichcomponentleadsorterminationsmaybeevaluatedforsolderabiiity.Λnyoneofthefollowingtestmethods-TestA,TestB,TestC,TestD,andTestS-maybeusedforSnPbsolderprocessesandanyoneofthefollowingtestmethods-TestAl,TestBl,TestCl,T

飘廖辍厂致^«高*VisualAcceptanceCriteriaTestsTestA-SolderBath/DipandLookTest(LeadedComponentsandStrandedWires)SnPbTestB-SolderBath/DipandLookTest(LeadlessComponents)SnPbSolder(4.22)TestC-WrappedWiresTest(Lugs,Tabs,HookedLeads,andTurrets)SnPbSolder(4.2.3)TestD-ResistancetoDissolution/DewettingofMetallizationTestSnPbSolderandPb-freeSolder(4.2.4)TestS-SurfaceMountProcessSimulationTestSnPbSolder(4.2.5)TestA1-SolderBath/DipandLookTest(LeadedComponentsandStrandedWires)Pb-freeSolder(4.2.6)TestBl-SolderBath/DipandLookTest(LeadlessComponents)Pb-freeSolder(4.2.7)TestCl-WrappedWiresTest(Lugs,Tabs.HookedLeads,andTurrets)Pb-freeSolder(4.2.8)TestSI-SurfaceMountProcessSimulationTestPb-freeSolder(4.2.9)ForceMeasurementTestsTestE-WettingBalanceSolderPotTest(LeadedComponents)SnPbSolder(4.3.1)TestF-WettingBahnceSolderPotTest(LeadlessComponents)SnPbSolder(4.3.2)∣TestG-WettingBalanceGlobuleTestSnPbSolder(4.3.3)TestEl-WettingBalanceSolderPotTest(LeadedComponents)Pb-freeSolder(4.3.4)TestFl-WettingBalanceSolderPotTest(LeadlessComponents)Pb-freeSolder(4.3.5)TestGl-WettingBalanceGlobuleTestPb-freeSolder(4.3.6)Thesemethods(1.3.2)areincludedforevaluationpurposesonly.DatacollectedshouldbesubmittedtotheIPCWettingBalanceTaskGroupforcorrelationandanalysis.TestsE,F,G,El,FlandGlshallnotbeusedforacceptance/rejectionwithoutuserandsupplieragreement.CoatingDurabilityThefollowingareguidelines,notspecificationrequirements,fordeterminingtheneededlevelofpreconditioningcategoryassurance(seeTable3-3).Thecoatingdurabilityguidelinesdescribetwobroadusagesectorsandarenotintendedtoencompassallpossibleproductusescenarios.Theuserandsupplierneedtoagreeonthecoatingdurabilityrequirements.CoatingDurabilityCategory2isthedefaultconditionforallcomponentfinishes.Category∕-MinimumCoatingDurabilityIntendedforsurfacesthatwillbesolderedwithinashortperiodoftime(e.g.,uptosixmonths)fromthetimeoftestingandarelikelytoexperienceaminimumofthermalexposuresbeforesoldering.NopreconditioningcategoryperTable3-3.Category2-TypicalCoatingDurabilityIntendedforsurfaceswhosesolderabilitymaybecomedegradedfromstorageoflongerthansixmonthsorfrommultiplethermalexposures.ThisispreconditioningCategoryEperTable3-3.SolderabilityBackwardsCompatibilityTypicallyPbcontainingterminationsareevaluatedusingSnPbsolderabilitytestconditionsandPb-freeterminationsusePb-freetestconditions.IfPb-freeterminationsaretobeusedinaSnPbsolderprocess(backwardcompatibility)thentheyshouldbeevaluatedat215℃usingtestparametersconsistentwithstandardSnPbsolderconditions.ThebackwardcompatibilitytestdoesnotapplytoPb-freeBGAtypepackages.RefereeVerificationSolderDipforTestsA,B,C,Al,B1,andC1Whenthedippedportionoftheterminationexhibitsanomaliessuchassurfaceroughness,dross,oranomaliesthatmayhavebeeninducedbyimpropersolderdipping,arefereeverificationsolderdipofthesuspectanomalymaybenecessary.Uponreinspection,ifthesuspectanomalyhasbeenremoved,theanomalywillhavebeenverifiedasanon-rejectablecosmeticsurfacedefect.Iftheanomalypersists,regardlessofareaitshallbeclassifiedarejectablesolderabilitydefect.Thisproceduremayonlybeusedonone∞mponentperlot.ContinuousneedofRefereeVerificationSolderDipprocedureisanindicationofeitherimpropertestingprocedure,examinationinterpretation,orofpoorcomponentquality.LimitationsThisstandardshallnotbeconstruedasaproductionprocedureforthepre-tinningofleadsandterminations.Solderabilitytestingofcomponentsisconsideredadestructivetestandthetestedcomponentshouldnotbeusedforfunctionalelectricalevaluation.ComponentsaftersuchsolderabiiitytestingshallonlybeusedAABUS.ContractualAgreementIncaseswherethestatedtestparametersareinappropriateorinsufficient,alternativeparametersmaybeAABUS.TermsandDefinitionsTermsrepeatedfromIPC-T-50areindicatedbyanasterisk(*).AABUSAbbreviationfor"asagreedbyuserandsupplier."Dewetting*Aconditionthatresultswhenmoltensoldercoatsasurfaceandthenrecedestoleaveirregularly-shapedmoundsofsolderthatareseparatedbyareasthatarecoveredwithathinfilmofsolderandwiththebasismeta!notexposed.DissolutionofComponentMetallization(Leaching)Thelossorremovalofmetallizationfromanareaonthebasisorsubstratematerialafterimmersioninmoltensolder.EquilibriumWettingThedegreeofwettinginwhichtheforcesofwettingareinbalancewiththeforcesofgravity.Nonwetting.Solder*Theinabilityofmoltensoldertoformametallicbondwiththebasismetal.Pinhole*Animperfectionintheformofasmallholethatpenetratesthroughalayerofmaterial.Solderability*Theabilityofametaltobewettedbymoltensolder.SolderConnectionPinhole