杜邦产品介绍

Introduction

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FlexibleCircuitMaterialsPresentedby:JonathanC.LimPartII:(~40minutes)簡報大綱軟性電路板基材之介紹基材的主要CompositionDielectricSubstrates(絕緣體)Adhesive(膠質)Conductor(導體)m簡報大綱(continue)杜邦產品壓克力膠系列(ModifiedWAAcrylic)之基材環亞樹脂膠系列(ModifiedEpoxy)之基材杜邦料號解說Pyralux®Telcam®m軟性電路板之主要基材CopperCladLaminates(銅箔基材)Single-SidedC.C.L.(單面銅箔基材)AdhesiveConductorDielectricSubstratemDouble-SidedC.C.L..(雙面銅箔基材)ConductorDielectricSubstrateAdhesive軟性電路板之主要基材mAdhesive-LessC.C.L..(無膠銅箔基材)DielectricSubstrateConductor軟性電路板之主要基材mCoverlay(覆蓋膜)軟性電路板之主要基材mDielectricSubstrateAdhesive離型紙AdhesiveKaptonStiffner(補強材)軟性電路板之主要基材DielectricSubstrateAdhesivemBondplyDielectricSubstrateAdhesiveAdhesive軟性電路板之主要基材mMylarAdhesiveKaptonAdhesiveSheetAdhesivePhotoImageableCoverlay(PIC)DryFilmFine-LineApplicationCameraAutomotiveOthers軟性電路板之主要基材mDielectricSubstratesDefinitionAbasefilmonwhichtheprintedconductorsarelaid.Afilmwhichprovideselectricalinsulationbetweenconductors.Afilmwhichprovidesmechanicalstrengthofthecircuit.m必備之特性性MechanicalStrengthFlexibilityDimensionalStabilityDielectricPropertiesThermalPropertiesChemicalResistanceMoistureAbsorptionCostDielectricSubstratesmSubstrates之種類PolyimidePolyesterFluorocarbonAramidPaperCompositeDielectricSubstratesmPolyimide:PopularizedbyDuPontunder““Kapton”AlsoknownasPIFirstchoiceoffilminmostFPCInfusibleandflameretardantHighTg(約260C-280C)GooddimensionalstabilitySubstratesmSubstratesPolyester:PopularizedbyDuPontunder““Mylar”AlsoknownasPETLowestcostdielectricmaterialMostlyusedinlow-costconsumerapplicationGoodmechanicalpropertiesBadthermalpropertiesmSubstratesAramidPaper:SoldunderDuPonttradename““Nomex”UsedinspecializedapplicationGoodthermalinsulationmaterialmPropertyPolyesterPolyimideFluorocarbonAramidPaperCompositeTensileStrengthExcellentExcellentFairGoodBestFlexibilityExcellentExcellentExcellentGoodFair/GoodDim.StabilityFair/GoodGoodFairGoodFair/GoodDielectricStr.GoodGoodVeryGoodVeryGoodGoodSolderibilityPoorExcellentFairExcellentExcellentC.O.T.(C)105200-230150-180220105-180ThermalExp.LowLowHighModerateLowChem.Resist.GoodGoodExcellentVeryGoodFairMoistureAbsorp.VeryLowHighVeryLowVeryHighLowCostLowHighHighModerateModerateTradeNameMylarKaptonTeflon/TedlarNomexDielectricSubstratesmAdhesiveDefinitionMaterialthatbondslayerstogetherThermosettingThermoplasticmAdhesive必備之特性性AdhesionStrengthFlexibilityChemicalResistanceThermalResistanceMoistureAbsorptionElectricalPropertiesCostmAdhesiveAdhesive之之種類PolyesterAcrylicEpoxyPolyimideButyralPhenolicmAdhesivePolyester:UsedwherethedielectricisalsopolyesterUsedwherenosolderingisneededTypicalapplication:InstantcamerafilminterconnectsInstrumentclusterconnectioninautomobilesmAdhesiveAcrylic:UsedindemandingtemperaturerequirementapplicationMostpopularacrylicsystemisPyraluxbyDuPontExcellentadhesionmAdhesiveEpoxy:WidelyusedadhesivesystemGenerallylowercostthanacrylicAbletostandwavesolderingGoodinhightemperatureforlongperiodoftime(400to450F)mAdhesivePolyimide:UsedinadhesivelesscclandcoverlayUsedwheredimensionstabilityiscriticalUsedinhightemperatureapplicationHighmoistureabsorptionmAdhesivePolyesterAcrylicEpoxyPolyimideButyralPhenolicTemp.Resist.Chem.Resit.Elec.Prop.AdhesionFlexibilityCostMoistureFairGoodExcellentExcellentExcellentLowFairVeryGoodGoodGoodExcellentVeryGoodGoodGoodGoodGoodGoodExcellentExcellentExcellentGoodGoodGoodGoodGoodGoodModerateFairFairVeryHighPoorFairFairHighModeratePoormConductors/FoilMajortypesofconductorsMetalsMetalalloysconductiveinksCopper(themostcommonlyusedconductorinFPC)Electrolyticallydepositedcopper(ED)RolledAnnealedcopper(RA)mConductors/Foil必備備之之特特性性Current-carryingcapacityFlexibilityServicetemperatureChemicalresistanceMechanicalstrengthCostmConductors/FoilElectricalPropertiesThermalPropertiesMechanicalPropertiesRelativeCostAluminumCopperGoldNickelSilverExcellentGoodExcellentExcellentExcellentExcellentExcellentExcellentGoodGoodGoodGoodGoodFairFair/GoodFairFairVeryGoodVeryGoodBestm軟板板基基材材製製造造過過程程CopperRollKaptonRollCopperCladLaminateHeater1Heater2LiquidAdhesiveAgingmIntroductiontoDuPontProductsmPartIII:(~15minutes)DuPontProductFamilyPyraluxPyraluxFRPyraluxLFPyraluxAPPyraluxPCTeclamTeclamFNCTeclamDNCPyralux®FR-series(AcrylicBased)Copper-CladLaminatesPanelFormPackaging.(24””x36””)ULApproved.(File#E124294)VeryGoodFlexureEnduranceEx.FR9111,FR9110,FR8510,FR8515CoverlayRollFormPackaging.(24””x250’’)ULApproved.(File#E124294)ExcellentDimensionalStabilityEx.FR0110,FR0210mPyralux®FRcontinue...SheetAdhesiveRollFormPackaging.(24””x250’’)ULApprovedEx.FR0100,FR0200BondPlyRollFormPackaging.(24””x250’’)ULApprovedEx.FR0111,FR0212mPyralux®LF-series(AcrylicBased)MilitarySpecificationsExcellentFlexureEnduranceVeryGoodforHigh-DensityCircuitrySameProductOfferingsasFR-seriesPC-series(Acrylic,urethane,&imide-based)DryFilmPhotoimageableCoverlayCameras&AutomotiveApplicationsmPyraluxP/N’sFR9111CuPICu7-Specialconstruction8-1/2oz.C.C.L.9-1ozormoreC.C.L.5-1/2oz.Cu1-1oz.Cu2-2oz.Cu1-1milPI2-2milPI3-3milPIFRLFAPCopper-CladLaminatesmPyraluxP/N’sFR0111Adh.PIAdh.FRLFAP7-Specialconstruction0-CoverlayorSheetAdhesive1-1miladhesive2-2miladhesive3-3miladhesive1-1milPI2-2milPI3-3milPICoverlay&SheetAdhesivemTeclam®FNC-s